]> git.baikalelectronics.ru Git - kernel.git/commit
hwmon: (max6650) add thermal cooling device capability
authorJean-Francois Dagenais <jeff.dagenais@gmail.com>
Fri, 19 Apr 2019 00:57:22 +0000 (20:57 -0400)
committerGuenter Roeck <linux@roeck-us.net>
Sat, 20 Apr 2019 14:08:15 +0000 (07:08 -0700)
commitf0f69f7314c0b286b24152cea92f564238d96d8e
tree4be6838793c8bf4b86e964828321731a3446475d
parent06202e7d294aec97a24d91a6a76801175534a04f
hwmon: (max6650) add thermal cooling device capability

This allows max6650 devices to be referenced in dts as a cooling device.

The pwm value seems duplicated in cooling_dev_state but since pwm goes
through rounding logic into data->dac, it is modified and messes with
the thermal zone state algorithms. It's also better to serve a cache
value, thus avoiding periodic actual i2c traffic.

Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
drivers/hwmon/Kconfig
drivers/hwmon/max6650.c