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ARM: dts: omap3: Add support for IGEP COM Module
authorJavier Martinez Canillas <javier.martinez@collabora.co.uk>
Wed, 19 Dec 2012 13:33:10 +0000 (14:33 +0100)
committerBenoit Cousson <benoit.cousson@linaro.org>
Mon, 8 Apr 2013 22:16:46 +0000 (00:16 +0200)
commitbffb7907417705ac55c52eed264bbc0efb8fbee6
treebcc48932c08c39014df328c1e822f158b8f85a62tree | snapshot
parent5ba13e5cb215b6be9143d0df7d79b8abadcd7a51commit | diff
ARM: dts: omap3: Add support for IGEP COM Module

ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.

This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
arch/arm/boot/dts/Makefile diff | blob | history
arch/arm/boot/dts/omap3-igep0030.dts [new file with mode: 0644] blob
Linux Kernel Source Tree.