]> git.baikalelectronics.ru Git - kernel.git/commit
usb: musb: introduce DA8xx/OMAP-L1x glue layer
authorSergei Shtylyov <sshtylyov@ru.mvista.com>
Fri, 24 Sep 2010 10:44:03 +0000 (13:44 +0300)
committerGreg Kroah-Hartman <gregkh@suse.de>
Fri, 22 Oct 2010 17:21:52 +0000 (10:21 -0700)
commit976d7864b6902a6b6334ef8a724296c0ea1ea1a0
treed9f962a3f95d88efc663b3d6b4c7920ec9632a4e
parent193ee63e9e4af74948ddb9d2008a1893c89fff48
usb: musb: introduce DA8xx/OMAP-L1x glue layer

Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
drivers/usb/musb/Kconfig
drivers/usb/musb/Makefile
drivers/usb/musb/da8xx.c [new file with mode: 0644]
drivers/usb/musb/musb_core.h