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(parent: 735e927) | patch
usb: dwc3: Add Exynos Specific Glue layer
authorAnton Tikhomirov <av.tikhomirov@samsung.com>
Wed, 15 Feb 2012 08:04:56 +0000 (17:04 +0900)
committerFelipe Balbi <balbi@ti.com>
Fri, 2 Mar 2012 10:11:28 +0000 (12:11 +0200)
commitf55daeec9e76bfbb0720551e0fceef6f87cfcc10
tree39d7c0b3f80657039cefc3996c20010bdbabbed0tree | snapshot
parent735e9270eceee615e796df9115c5526bbfe318c2commit | diff
usb: dwc3: Add Exynos Specific Glue layer

Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.

[ balbi@ti.com : prevent compilation of Exynos glue layer
on platforms which don't provide clk API implementation ]

Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
drivers/usb/dwc3/Makefile diff | blob | history
drivers/usb/dwc3/dwc3-exynos.c [new file with mode: 0644] blob
include/linux/platform_data/dwc3-exynos.h [new file with mode: 0644] blob
Linux Kernel Source Tree.