usb: dwc3: add ST dwc3 glue layer to manage dwc3 HC

usb: dwc3: add ST dwc3 glue layer to manage dwc3 HC

This patch adds the ST glue logic to manage the DWC3 HC
on STiH407 SoC family. It manages the powerdown signal,
and configures the internal glue logic and syscfg registers.

[ balbi@ti.com : actually switch over to of_platform_depopulate() ]

Signed-off-by: Giuseppe Cavallaro <peppe.cavallaro@st.com>
Signed-off-by: Peter Griffin <peter.griffin@linaro.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Felipe Balbi <balbi@ti.com>