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(parent: 49d8bfc) | patch
bonding: ust micro BOND_NO_USE_ARP to simplify the mode check
authordingtianhong <dingtianhong@huawei.com>
Sat, 21 Dec 2013 06:40:17 +0000 (14:40 +0800)
committerDavid S. Miller <davem@davemloft.net>
Tue, 31 Dec 2013 05:40:31 +0000 (00:40 -0500)
commitc0805b2fef3e785d38ddc37eab70588371dcaf96
tree5f0df724b448a7f856b791b6a62db1334126005atree | snapshot
parent49d8bfc106e6941da5f4bcbf71677a680b019126commit | diff
bonding: ust micro BOND_NO_USE_ARP to simplify the mode check

The bond 3ad and TLB/ALB has the same check path, so combine them.

Signed-off-by: Ding Tianhong <dingtianhong@huawei.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
drivers/net/bonding/bond_main.c diff | blob | history
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