]> git.baikalelectronics.ru Git - kernel.git/commit
USB: OHCI: DA8xx/OMAP-L1x glue layer
authorSergei Shtylyov <sshtylyov@ru.mvista.com>
Fri, 12 Feb 2010 19:52:34 +0000 (23:52 +0400)
committerGreg Kroah-Hartman <gregkh@suse.de>
Tue, 2 Mar 2010 22:55:06 +0000 (14:55 -0800)
commit4fb154388d6bcf3cde2252c9db4eb7a5c4ff6bfd
tree615fdbfb7928e5deee4f5051bf21246c433a9a26
parent11d0f07aa89e6fe93a8ec06b50f5f5b3fc234230
USB: OHCI: DA8xx/OMAP-L1x glue layer

Texas Instruments DA8xx/OMAP-L1x OHCI glue layer.

This OHCI implementation is not without quirks: there's only one physical port
despite the root hub reporting two; the port's power control and over-current
status bits are not connected to any pins, however, at least on the DA830 EVM
board, those signals are connected via GPIO, thus the provision was made for
overriding the OHCI port power and over-current bits at the board level...

Signed-off-by: Mikhail Cherkashin <mcherkashin@ru.mvista.com>
Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
drivers/usb/Kconfig
drivers/usb/host/ohci-da8xx.c [new file with mode: 0644]
drivers/usb/host/ohci-hcd.c